1 fn6613.1 ISL6406MR, isl6406mv enhanced product (ep) single synchronous buck pulse-width modulation (pwm) controller the ISL6406MRep and isl6406mvep are adjustable frequency, synchronous buck switching regulators optimized for generating lower voltages for distributed dc/dc architectures. both devices feature an adjustable output voltage. designed to drive n-channel mosfets in a synchronous buck topology, the ISL6406MRep and isl6406mvep integrate the control, output adjustment and protection functions into a single package. the ISL6406MRep and isl6406mvep provide simple, single feedback loop, voltage-mode control with fast transient response. the output voltage can be precisely regulated to as low as 0.8v. the error amplifier features a 15mhz gain-bandwidth product and 6v/ s slew rate which enables high converter bandwidth for fast transient performance. protection from overcurrent co nditions is provided by monitoring the r ds(on) of the upper mosfet to inhibit pwm operation appropriately. this approach simplifies the implementation and improves efficiency by eliminating the need for a current sense resistor. the wide programmable switching frequency range of 100khz to 700khz allows the use of small surface mount inductors and capacitors. the device also provides external frequency synchronization making it an ideal choice for dc/dc converter applications. device information the specifications for an enhanced product (ep) device are defined in a vendor item drawing (vid), which is controlled by the defense logistics agency (dla). ?hot-links? to the applicable vid and other supporting application information are provided on our website. features ? specifications per dla vid v62/08610 ? full mil-temp electrical perf ormance from -55c to +125c ? controlled baseline with one wafer fabrication site and one assembly/test site ? full homogeneous lot processing in wafer fab ? no combination of wafer fabrication lots in assembly ? full traceability through assembly and test by date/trace code assignment ? enhanced process change notification ? enhanced obsolescence management ? eliminates need for up-screening a cots component ? operates from 3.3v/5v input ? 0.8v to v in output range - 0.8v internal reference - 2.1% reference accuracy over-temperature ? simple single-loop control design - voltage-mode pwm control ? fast transient response - high-bandwidth error amplifier ? lossless, programmable overcurrent protection - uses upper mosfet?s r ds(on) ? programmable switching frequency 100khz to 700khz ? external frequency synchronization ? internal soft-start applications ? 3v/5v dc/dc converter modules ? distributed dc/dc 3.3v, 2.5v and 1.8v power architectures for dsp, logic, and memory ? power supplies for microprocessors -pcs - embedded controllers ? memory supplies ? personal computer peripherals data sheet november 11, 2011 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2007, 2011. all rights reserved all other trademarks mentioned are the property of their respective owners.
2 fn6613.1 november 11, 2011 pinouts ISL6406MRep (16 ld qfn) top view isl6406mvep (16 ld tssop) top view cpvout ocset ct1 ct2 lgate gnd ugate boot phase vcc cpgnd comp rt sync/en fb vout 1 3 4 15 16 14 13 2 12 10 9 11 6 578 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 gnd lgate cpvout ocset ct1 ct2 sync/en rt ugate phase vcc cpgnd comp vout fb boot ordering information vendor part number (notes 1, 2) vendor item drawing part marking temp. range (c) package pkg. dwg. # ISL6406MRep v62/08610-01xb 6406mrep -55 to +125 16 ld 5x5 qfn l16.5x5b ISL6406MRep-tk v62/08610-01xb 6406mrep -55 to +125 16 ld 5x5 qfn l16.5x5b isl6406mvep v62/08610-01yb 6406 mvep -55 to +125 16 ld tssop m16.173 isl6406mvep-tk v62/08610-01yb 6406 mvep -55 to +125 16 ld tssop m16.173 notes: 1. ?-tk? suffix is for 1,000 piece quantity tape and reel. please refer to tb347 for details on reel specifications. 2. devices must be procured to the vendor part number. ISL6406MR, isl6406mv
3 fn6613.1 november 11, 2011 ISL6406MR, isl6406mv quad flat no-lead plastic package (qfn) micro lead frame pl astic package (mlfp) l16.5x5b 16 lead quad flat no-lead plastic package (compliant to jedec mo-220vhhb issue c) symbol millimeters notes min nominal max a 0.80 0.90 1.00 - a1 - - 0.05 - a2 - - 1.00 9 a3 0.20 ref 9 b 0.28 0.33 0.40 5, 8 d 5.00 bsc - d1 4.75 bsc 9 d2 2.95 3.10 3.25 7, 8 e 5.00 bsc - e1 4.75 bsc 9 e2 2.95 3.10 3.25 7, 8 e 0.80 bsc - k0.25--- l 0.35 0.60 0.75 8 l1 - - 0.15 10 n162 nd 4 3 ne 4 3 p--0.609 --129 rev. 1 10/02 notes: 1. dimensioning and tolerancing conform to asme y14.5-1994. 2. n is the number of terminals. 3. nd and ne refer to the number of terminals on each d and e. 4. all dimensions are in millimeters. angles are in degrees. 5. dimension b applies to the meta llized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. the configuration of the pin #1 identifier is optional, but must be located within the zone indicated. the pin #1 identifier may be either a mold or mark feature. 7. dimensions d2 and e2 are fo r the exposed pads which provide improved electrical and thermal performance. 8. nominal dimensions are provided to assist with pcb land pattern design efforts, see intersil technical brief tb389. 9. features and dimensions a2, a3, d1, e1, p & are present when anvil singulation method is used and not present for saw singulation. 10. depending on the method of lead termination at the edge of the package, a maximum 0.15mm pull back (l1) maybe present. l minus l1 to be equal to or greater than 0.3mm.
4 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6613.1 november 11, 2011 ISL6406MR, isl6406mv thin shrink small outlin e plastic packages (tssop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-153-ab, issue e. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. controlling dimension: millimeter. converted inch dimen- sions are not necessarily exact. (angles in degrees) index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 0.05(0.002) m16.173 16 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.043 - 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.033 0.037 0.85 0.95 - b 0.0075 0.012 0.19 0.30 9 c 0.0035 0.008 0.09 0.20 - d 0.193 0.201 4.90 5.10 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.020 0.028 0.50 0.70 6 n16 167 0 o 8 o 0 o 8 o - rev. 1 2/02
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